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Basic Info.
Model NO. | SAC305 | Material | Sn96.5Ag3.0Cu0.5 |
Melting Point | 217±2℃ | Individual bottle weight | 500g/ bottle |
Shape | paste | granule | 20-40(μm) |
Packaging | 10kg/box | Origin | China |
Product Description
First variety of alloy forms and packaging: Our solder paste products are available in a variety of different alloy forms and packaging options to meet different customer needs and applications.
The second wide range of metal alloy content: we can adjust the content of metal alloys to meet the requirements of different welding processes to ensure welding quality and performance.
Third introduction of FCT technology: We have introduced FCT (Fine Ceramic Transfers) technology, which is a leading welding technology to improve the reliability and stability of welded connections.
Fourth automated production equipment: We use industry-leading automated production equipment to produce solder paste to ensure a high degree of consistency and stability.
Fifth active solder paste technology: Our technology contains a mixture of active solder paste and low oxide tin powder, which can be customized according to the customer's process requirements to provide excellent welding performance.
Sixth packaging options: We can provide a variety of packaging options according to customer needs, including filling, simple packaging, needle installation, etc., to facilitate customer use.
Seventh environmentally friendly solder paste: We can customize environmentally friendly non-washing type and environmentally friendly halogen-free solder paste according to the quality requirements of customers to meet the environmental requirements.
Product Specifications
Model NO. | type of production | Ingredient (WT%) |
SAC0307 | lead-free solder paste | Sn99Ag0.3Cu0.7 |
SAC0305 | lead-free solder paste | Sn96.5Ag3.0Cu0.5 |
SAC105 | lead-free solder paste | Sn98.5Ag1Cu0.5 |
SAC9307 | lead-free solder paste | Sn99.3Cu0.7 |
Product Features
Tin-quick
Superior wettability
Good continuous weldability
Fast diffusion rate
The solder joint is firm and full
Superior electrical performance
High viscosity
Low cavity rate
Basic Info.
Model NO. | SAC305 | Material | Sn96.5Ag3.0Cu0.5 |
Melting Point | 217±2℃ | Individual bottle weight | 500g/ bottle |
Shape | paste | granule | 20-40(μm) |
Packaging | 10kg/box | Origin | China |
Product Description
First variety of alloy forms and packaging: Our solder paste products are available in a variety of different alloy forms and packaging options to meet different customer needs and applications.
The second wide range of metal alloy content: we can adjust the content of metal alloys to meet the requirements of different welding processes to ensure welding quality and performance.
Third introduction of FCT technology: We have introduced FCT (Fine Ceramic Transfers) technology, which is a leading welding technology to improve the reliability and stability of welded connections.
Fourth automated production equipment: We use industry-leading automated production equipment to produce solder paste to ensure a high degree of consistency and stability.
Fifth active solder paste technology: Our technology contains a mixture of active solder paste and low oxide tin powder, which can be customized according to the customer's process requirements to provide excellent welding performance.
Sixth packaging options: We can provide a variety of packaging options according to customer needs, including filling, simple packaging, needle installation, etc., to facilitate customer use.
Seventh environmentally friendly solder paste: We can customize environmentally friendly non-washing type and environmentally friendly halogen-free solder paste according to the quality requirements of customers to meet the environmental requirements.
Product Specifications
Model NO. | type of production | Ingredient (WT%) |
SAC0307 | lead-free solder paste | Sn99Ag0.3Cu0.7 |
SAC0305 | lead-free solder paste | Sn96.5Ag3.0Cu0.5 |
SAC105 | lead-free solder paste | Sn98.5Ag1Cu0.5 |
SAC9307 | lead-free solder paste | Sn99.3Cu0.7 |
Product Features
Tin-quick
Superior wettability
Good continuous weldability
Fast diffusion rate
The solder joint is firm and full
Superior electrical performance
High viscosity
Low cavity rate
What is the reason for the blackening of solder tin wire solder joints?
Lead tin wire is mainly used for manual soldering, traditional electronic products, and certain specific electronic components; Lead free tin wires are increasingly being used in environmentally friendly or export-oriented electronic products, medical equipment, high-performance electronic devices, and other fields.
Temperature Control And Techniques for Lead-free Solder Wire
solder wire, Tin wire in Chinese, solder wire in English, solder wire is composed of solder alloy and flux. The alloy components can be divided into solder lead alloy, solder copper alloy, solder silver copper alloy, and solder silver copper alloy.
Low-temperature lead-free solder wires have emerged as a game-changer in the manufacturing industry, especially for acoustic products. These innovative solder wires offer several benefits that make them an ideal choice for various applications. In this article, we will explore the advantages of usin