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Basic Info.
Model NO. | SAC305 | Material | Sn96.5Ag3.0Cu0.5 |
Melting Point | 217±2℃ | Individual bottle weight | 500g/ bottle |
Shape | paste | granule | 20-40(μm) |
Packaging | 10kg/box | Origin | China |
Product Description
First variety of alloy forms and packaging: Our solder paste products are available in a variety of different alloy forms and packaging options to meet different customer needs and applications.
The second wide range of metal alloy content: we can adjust the content of metal alloys to meet the requirements of different welding processes to ensure welding quality and performance.
Third introduction of FCT technology: We have introduced FCT (Fine Ceramic Transfers) technology, which is a leading welding technology to improve the reliability and stability of welded connections.
Fourth automated production equipment: We use industry-leading automated production equipment to produce solder paste to ensure a high degree of consistency and stability.
Fifth active solder paste technology: Our technology contains a mixture of active solder paste and low oxide tin powder, which can be customized according to the customer's process requirements to provide excellent welding performance.
Sixth packaging options: We can provide a variety of packaging options according to customer needs, including filling, simple packaging, needle installation, etc., to facilitate customer use.
Seventh environmentally friendly solder paste: We can customize environmentally friendly non-washing type and environmentally friendly halogen-free solder paste according to the quality requirements of customers to meet the environmental requirements.
Product Specifications
Model NO. | type of production | Ingredient (WT%) |
SAC0307 | lead-free solder paste | Sn99Ag0.3Cu0.7 |
SAC0305 | lead-free solder paste | Sn96.5Ag3.0Cu0.5 |
SAC105 | lead-free solder paste | Sn98.5Ag1Cu0.5 |
SAC9307 | lead-free solder paste | Sn99.3Cu0.7 |
Product Features
Tin-quick
Superior wettability
Good continuous weldability
Fast diffusion rate
The solder joint is firm and full
Superior electrical performance
High viscosity
Low cavity rate
Basic Info.
Model NO. | SAC305 | Material | Sn96.5Ag3.0Cu0.5 |
Melting Point | 217±2℃ | Individual bottle weight | 500g/ bottle |
Shape | paste | granule | 20-40(μm) |
Packaging | 10kg/box | Origin | China |
Product Description
First variety of alloy forms and packaging: Our solder paste products are available in a variety of different alloy forms and packaging options to meet different customer needs and applications.
The second wide range of metal alloy content: we can adjust the content of metal alloys to meet the requirements of different welding processes to ensure welding quality and performance.
Third introduction of FCT technology: We have introduced FCT (Fine Ceramic Transfers) technology, which is a leading welding technology to improve the reliability and stability of welded connections.
Fourth automated production equipment: We use industry-leading automated production equipment to produce solder paste to ensure a high degree of consistency and stability.
Fifth active solder paste technology: Our technology contains a mixture of active solder paste and low oxide tin powder, which can be customized according to the customer's process requirements to provide excellent welding performance.
Sixth packaging options: We can provide a variety of packaging options according to customer needs, including filling, simple packaging, needle installation, etc., to facilitate customer use.
Seventh environmentally friendly solder paste: We can customize environmentally friendly non-washing type and environmentally friendly halogen-free solder paste according to the quality requirements of customers to meet the environmental requirements.
Product Specifications
Model NO. | type of production | Ingredient (WT%) |
SAC0307 | lead-free solder paste | Sn99Ag0.3Cu0.7 |
SAC0305 | lead-free solder paste | Sn96.5Ag3.0Cu0.5 |
SAC105 | lead-free solder paste | Sn98.5Ag1Cu0.5 |
SAC9307 | lead-free solder paste | Sn99.3Cu0.7 |
Product Features
Tin-quick
Superior wettability
Good continuous weldability
Fast diffusion rate
The solder joint is firm and full
Superior electrical performance
High viscosity
Low cavity rate
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