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Product information
| Name | High temperature solder bar | Brand | Singway |
Model NO. | 8812 | Material | Sn88Sb12 |
Melting Point | 260±2℃ | Individual strip weight | About 0.72kg/ piece |
Shape | Strip, stick | thickness | 21mm |
width | 13mm | length | 331mm |
Packaging | 20kg/box | Origin | China |
Product Description
Product Specifications
Model NO. | Ingredient (WT%) | Melting Point(℃） | Application |
995 | Sn99.3Cu0.7 | 227 | High temperature solder, suitable for copper enamelled wire one-time detinning tin and high temperature element foot tin. |
8812 | Sn88Sb12 | 260 | Lead-free solder high melting point of high temperature tin bar, suitable for high melting point demand components industry. |
| EB9010 | Sn42Bi58 | Lead-free low temperature solder, designed for customers with low temperature operation low temperature fuse protection and other soldering process. |
Metod of application
 | Addition of new tin strip in wave soldering: |
| During the wave crest welding process, the amount of tin will continue to decrease, when it is reduced to a certain extent, a new solder strip/tin strip should be added in time to maintain the liquid level of tin and to increase the oxidation of tin due to the large tin wave drop. |
| Removal of scum in wave soldering: |
Scum is an oxide that forms on the surface of the solder, and the rate at which it is produced is dependent on temperature and agitation. The higher the temperature is, the larger the gauge flow on the solder surface and the more scum formed. Antioxidants can also be added to form a protective film on the tin surface to reduce tin oxidation. The oxide on the solder surface prevents the solder from being reoxidized, so it is not necessary to remove scum frequently. As long as it doesn't affect the waves Push. Just clean it out once a day. It is also possible to push the tin slag to a corner, add reducing powder to the tin slag and stir again to reduce most of the tin slag to tin. |
Product Features
High-melting-point
Tin antimony alloy ratio
Good mobility
Solid solder joint
Quick on the tin
Low tin slag
Hight temperature resistance 260℃
High reliability
Product information
| Name | High temperature solder bar | Brand | Singway |
Model NO. | 8812 | Material | Sn88Sb12 |
Melting Point | 260±2℃ | Individual strip weight | About 0.72kg/ piece |
Shape | Strip, stick | thickness | 21mm |
width | 13mm | length | 331mm |
Packaging | 20kg/box | Origin | China |
Product Description
Product Specifications
Model NO. | Ingredient (WT%) | Melting Point(℃） | Application |
995 | Sn99.3Cu0.7 | 227 | High temperature solder, suitable for copper enamelled wire one-time detinning tin and high temperature element foot tin. |
8812 | Sn88Sb12 | 260 | Lead-free solder high melting point of high temperature tin bar, suitable for high melting point demand components industry. |
| EB9010 | Sn42Bi58 | Lead-free low temperature solder, designed for customers with low temperature operation low temperature fuse protection and other soldering process. |
Metod of application
| Addition of new tin strip in wave soldering: |
| During the wave crest welding process, the amount of tin will continue to decrease, when it is reduced to a certain extent, a new solder strip/tin strip should be added in time to maintain the liquid level of tin and to increase the oxidation of tin due to the large tin wave drop. |
| Removal of scum in wave soldering: |
Scum is an oxide that forms on the surface of the solder, and the rate at which it is produced is dependent on temperature and agitation. The higher the temperature is, the larger the gauge flow on the solder surface and the more scum formed. Antioxidants can also be added to form a protective film on the tin surface to reduce tin oxidation. The oxide on the solder surface prevents the solder from being reoxidized, so it is not necessary to remove scum frequently. As long as it doesn't affect the waves Push. Just clean it out once a day. It is also possible to push the tin slag to a corner, add reducing powder to the tin slag and stir again to reduce most of the tin slag to tin. |
Product Features
High-melting-point
Tin antimony alloy ratio
Good mobility
Solid solder joint
Quick on the tin
Low tin slag
Hight temperature resistance 260℃
High reliability
